电镀工艺工程师

该职位来源于猎聘 职责描述：

Principal Accountabilities 主要权责

• 熟悉机台性能，撰写生产标准作业流程，根据实际情况进行Recipe修改和优化；

Professional experience on equipment，create OI and SOP and optimize Recipe.

• 熟悉机台的参数和意义，独立进行机台的日常点检;

Family with equipment function and key parameters, could do daily check and find abnormality.

• 熟练掌握电镀工艺，维护inline/offline SPC以满足生产和产品需求;
• Familiar with the electroplating process, maintain inline/offline SPC and to meet production and product requirements
• 能够处理日常常见机台异常状况,并安全处理产品。

Able to handle the common tool issue and handle the production wafer safely.

• 熟练掌握电镀recipe,能够独立完成机台set up时的机台调试。

Familiar with the plating recipe, can complete fine tune recipe when tool set up.

• 能够独立操作电镀工艺相关量测机台；

Ability to independently operate the electroplating process

• 与工程师及制造部合作解决生产中遇到的问题；

Co-work with engineer for trouble shooting. Co-work with MFG to fix line issue.

• 完成课经理安排的工作；

Complete the Job assigned by manager

• 负责对助工进行相关的培训；

Conduct training for technician on PM/trouble shooting/6S/safety.

• 良好的安全意识，6S意识，可以处理突发状况；

Good safety and 6S concept, could handle emergency case.

• 能够协助工程师完成一些生产设备优化项目,有良好的团队合作精神；

Assist engineer to complete some projects and achieve goal, with good team work.

• 熟练掌握电镀添加剂工作原理以及数据分析.

Ability to Working principle and data analysis of skilled plating additives.

POSITION SPECIFICATION任职要求

EDUCATION 学历

大学本科及以上学历，微电子、工科类相关专业；

Bachelor degree or above, major in microelectronics, engineering;

Experience 经验 2年以上半导体行业电镀制程工作经验。有AMAT,LAM电镀制程相关工作经验优先。

2+ years’ experience in ECP equipment. AMAT,LAM ECP Electroplating tool expert is preferred.

Other Essential Attributes 其他要求

• 有较好的英文听说读写能力；

Fluent in listening, speaking, reading & written English;

• 熟练使用office办公软件。

Competent in using MS-Office software.

• 可以倒班

职位福利：五险一金、绩效奖金、加班补助、餐补、带薪年假、定期体检、节日福利