烟台德邦科技有限公司
芯片底填胶黏剂研发工程师
2 months ago
Share this opportunity
Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.
Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
14 August 2026
What they need
该职位来源于猎聘 职责描述： 主要负责muf 或 cuf 或 LMC研发经验 任职要求： 具有底部填充材料开发经验（芯片级底部填充材料开发经验者优先考虑），本科学历有相关行业研发背景可放宽
Other offers great for you!
These companies are also looking for great profiles
C
CAPEFRONT Energies
Senior Installation Engineers
Freelance
Lisbon, Portugal
Onsite
Skills
SURF
19 hours ago
Quick apply
N
Nexoris
Développeur Fullstack C# / Angular – IT Risk / Market Risk
610
Freelance
Paris, France
Onsite, Hybrid
Skills
C#AngularSQL Server et Entity Framework. - CI/CD : BitbucketJenkins. - Déploiement et gestion des releases : XL DeployXL Release. - Gestion des artefacts : Artifactory. - Ordonnancement et exploitation des Batchs : Control-M. - Python (atout apprécié). - Connaissance fonctionnelle des risques de marché (Market Risk)appréciée.
18 hours ago
Quick apply
S
Salutech
Profils migration SI bancaire
450
Freelance
Paris, France
Onsite, Hybrid
Skills
Mainframe
18 hours ago
Quick apply
No company information available.