封测外包运营主任工程师

该职位来源于猎聘 About the role

职位概述 Due to recent growth and step-up, we have an exciting opportunity available for Engineering to join our BackEnd External Manufacturing team positioned in China. You will be main interface between Nexperia and Subcontractors. 基于近期的业务增长与升级，我们为工程部门提供了一个激动人心的机会，加入我们位于中国的后端外部制造团队。您将成为Nexperia与外包制造商之间的主要接口。 What you will do 工作职责 In this position, you will be responsible for the following but not limited to. 在此职位上，您将负责以下（但不限于）工作：

• Assembly Technical Lead Assembly Change Request reviewer (First level approver of New Process / Material introduced by Subcon). 组装技术负责人，组装变更请求审核员（对于外包商引入的新工艺/材料的首位审批人）。
• Support Process Risk Assessment

支持工艺风险评估

• Industrial Project interface / Engineering Lead 工业项目接口人/工程负责人
• Drive Subcon /Service Provider Performance and support production line issue resolution. 推动外包商/服务提供商绩效，并支持生产线问题解决。
• Drive and monitor Value Engineering / Cost Down Activities 推动并监控价值工程/降本活动
• R&D and NPI support (if needed) 研发与新產品導入支持（如需）
• BCAMx / Milestone reviewer (for Industrial projects) BCAMx/里程碑审核员（针对工业项目）
• Support to drive Subcontractor Performance (Operational KPIs) and Monitor Quality KPIs

支持推动外包商绩效（运营关键绩效指标）并监控质量关键绩效指标

• Support to drive Value engineering projects for Cost improvement 支持推动价值工程项目以实现成本改善
• Support Customer compliant Handling process and verification on site.

支持客户投诉处理流程及现场验证。

• Support Quality/VDA and Customer audits

支持质量/VDA及客户审核

• Support Projects/STRs and Project overview monitoring

支持项目/STR及项目总体情况监控 What you will need 任职要求

• Bachelor’s degree in engineering (Electrical / Electronics/Mechanical). 工程学士学位（电气/电子/机械）。
• At least 5 years of experience IC Assembly/ wafer level /Process Engineering in High Volume - High Mix production environment. 至少5年在高产量、多品种生产环境中的IC组装/晶圆级/工艺工程经验。
• Project Management skills 项目管理技能
• Excellent written and verbal communication skills 出色的书面与口头沟通能力
• Good attitude in collaboration, team player and solution finding

良好的协作态度、团队精神及解决方案寻找能力

• Analytical and problem-solving skills

分析与解决问题能力