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工艺工程师(清洗、磨抛、切割)

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工艺工程师(清洗、磨抛、切割)

成都泰美克晶体技术有限公司

工艺工程师(清洗、磨抛、切割)

2 months ago

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Important information


Contract type:

Permanent

Location:

Chengdu, Sichuan, China

Work mode:

Onsite

Published on:

22 August 2026

What they need


该职位来源于猎聘 1、为现场作业人员提供技术支持,快速处理生产工艺异常,指导团队攻克复杂工艺难题,保障生产流程稳定。 2、编制优化标准化作业 SOP,统一工艺执行标准;熟练操作维护研磨、抛光、切割、CNC 及清洗设备,按需调试参数,参与设备选型并给出合理化建议。 3、建立并完善工艺质量管控体系,监督标准执行;分析生产数据、排查隐患并落实预防改善措施,降低产品不良率。 4、开展质量问题根因分析与专项改善,负责新产品工艺验证及量产导入 技能要求: 1.切割:熟悉金刚线、砂浆线,激光切割、划切机 2.磨抛:熟悉宇晶、森永、化学腐蚀抛光(CMP) 3.清洗:熟悉自动和半自动清洗机、洗过半导体或者光学产品微小产品,光洁度要求较高的,有除胶除蜡的经验

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