牛芯半导体(深圳)有限公司
数字后端工程师（实习）
2 months ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
24 August 2026
What they need
该职位来源于猎聘 职责描述： 1、负责与前端设计工程师合作完成芯片的面积优化、功耗分析、时序分析及版图规划； 2、负责数字芯片自动布局布线，完成从Netlist到GDS的物理实现； 3、负责芯片物理验证； 4、负责芯片的时序分析及时序收敛。 任职要求： 1、微电子、集成电路、电子信息等相关专业本科四年级或硕士在读； 2、熟悉后端EDA工具及从RTL代码到GDS版图的物理设计全流程者优先； 3、具有数字后端设计且流片经验者优先。 4、具备责任感、独立工作能力与良好的团队协作精神； 你将获得： 丰厚的实习工资/导师一对一指导/优先转正的机会/其他公司福利...
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