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人工智能/芯片硬件 模型子开发(研发方向)

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Onsite

人工智能/芯片硬件 模型子开发(研发方向)

电装(中国)投资有限公司

人工智能/芯片硬件 模型子开发(研发方向)

Skills

Python

2 months ago

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Important information


Contract type:

Internship

Work mode:

Onsite

Published on:

27 August 2026

What they need


职位来源于实习僧。

(实习3~4天/周 实习6个月以上) 【岗位职责】:

  • 面向高通 NPU 开展模型算子的开发、移植与性能优化
  • 基于 HMX/HVX 进行底层编程,充分发挥 NPU 硬件性能
  • 使用 TileLang、Triton 等 DSL 高效实现并优化模型算子
  • 参与 TVM、MLIR 等编译框架的开发、适配与优化
  • 支持 LLM 等模型的端侧部署,定位并解决编译、算子与运行时问题 【岗位要求】: 1. 熟练掌握 C++、Python 编程,具备扎实的工程开发能力 2. 熟悉 TVM、MLIR 等编译框架 3. 熟悉高通 NPU 硬件架构,具备 HMX/HVX 编程经验 4. 熟悉 TileLang、Triton 等 DSL,能够高效实现并优化模型算子 【加分项】:
  • 深入理解 DSL 编译器工作原理,熟悉关键优化 Pass 与编译管线
  • 理解 LLM 推理流程,熟悉 llama.cpp、vLLM 等主流推理框架
  • 具备端侧模型部署与性能优化经验 职位薪资: 200-300/天

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