芯和半导体科技(上海)有限公司
前端设计工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
30 August 2026
What they need
该职位来源于猎聘 工作职责: 1.负责芯片数字前端设计开发工作,包括SoC架构定义和集成、IP设计等。 2.负责芯片的架构设计、逻辑设计、代码编写与仿真; 3.定义数字模块功能、接口、时序,编写芯片设计文档; 4.完成模块综合、时序分析、异步检查、等效性验证等前端设计流程; 5.完成FPGA测试,模块及系统验证; 6.协助后端设计人员共同完成项目设计任务。
任职要求: 欢迎2027届毕业生投递简历 1.电子学、微电子学或相关专业硕士及以上学历 2.具备数字电路知识、了解半导体物理、半导体器件知识 3. 具有Verilog HDL, System Verilog 编写技能 4.善于学习、良好的沟通和团队合作精神
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