江苏捷捷微电子股份有限公司
封装工艺工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Nantong, Jiangsu, China
Work mode:
Onsite
Published on:
31 August 2026
What they need
该职位来源于猎聘 1.封装设备调试，确保生产线稳定运行； 2.处理产线异常/低良批次，调查原因并采取纠正/改善措施，制程能力及良率持续提升；
- 工程批的程序建立、调试、反馈、数据收集与报告生成； 4.产线操作人员技能培训，提升生产线人员技能； 5.配合工艺工程师完成客户审核，收集数据，处理客诉及提交8D报告； 6.封装设备评估及验证 任职资格： 1.微电子、电子、电气、机械，电化学，化工，材料类等相关专业； 2.大学本科（含）以上学历； 3.英语CET-4及以上； 4.具备快速学习新知识能力，对半导体封装技术有较高的兴趣和热情； 5.具备良好的沟通协作能力和团队合作精神； 6.较好的抗压能力
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