成都泰美克晶体技术有限公司
融资专员/助理
1 month ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
17 September 2026
What they need
该职位来源于猎聘 岗位职责: (1)搜集硬脆材料、石英晶片、光学光通信及电子元器件行业的政策热点、行业动态,跟踪行业融资、并购等资本市场动态; (2)参与投融资全流程工作,包括与投资机构的路演、尽职调查、协议签署等,负责会议纪要整理及尽调资料准备; (3)基于公司发展战略及融资方向,负责组织开展行业及对标公司研究,撰写研究报告; (4)配合完成公司投融资的其他相关工作。 能力要求: 1. 熟悉办公软件,Word、Excel、PPT等,具备良好的文字功底和报告撰写能力; 2. 具备较强的沟通和协调能力,工作细致认真、责任心强; 3. 服从管理,保密意识强,具备团队协作精神; 4. 有一定投融资、行业研究经验,金融、经济、财会、管理类等相关专业优先。
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