捷普科技(上海)有限公司
芯片后端设计工程师
1 month ago
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Important information
Contract type:
Permanent
Location:
Hangzhou, Zhejiang, China
Work mode:
Onsite
Published on:
23 September 2026
What they need
该职位来源于猎聘 职位描述 1、负责芯片子模块从Netlist到GDS全流程物理实现，包括synthesis,Placement、CTS、Routing、STA 和其他的Sign-off； 2、执行DRC/LVS物理验证，处理工艺规则检查，定位并解决时序、串扰、功耗、良率相关问题。 任职要求 1、能在带领下参与电路后端设计项目。 2、计算机、通信、电子、自动化等相关专业硕士学位或计算机、通信、电子、自动化等相关专业学士学位并有工作经验（至少5年）。
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