上海庄臣有限公司
工艺器件工程师（contact window方向）
2 years ago
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Important information
Contract type:
Permanent
Location:
Wenzhou, Zhejiang, China
Work mode:
Onsite
Published on:
8 August 2026
What they need
该职位来源于猎聘 一、职责描述： 1.负责协助designer完成前期IP评估，项目kick off 2.负责与foundry及封装厂对接，确定工艺平台选择&封装方式，并推动产品按计划产品
- 负责产品特殊工艺线process flow set up & 新产品tape out 4.负责解决foundry & 封装厂 process issue &
yield improve 5. 负责整合内外部资源，协调各方关系，确保项目所需资源得到及时、有效的支持 二、任职资格： 1. 本科及以上学历; 物理、集成电路、微电子、电子科学与技术等相关专业。 2.两年以上半导体行业相关工作经验 3.熟悉fab或封装厂项目管理流程，有fab厂PIE或CE经验者优先 4.良好学习能力与沟通能力，较强的问题分析能力&抗压能力，优秀的团队协作能力。 5.积极主动，踏实稳重，工作严谨，责任心强
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