芯联集成电路(上海)有限公司
DE-器件设计工程师（2027届）(J10882)
2 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
17 August 2026
What they need
该职位来源于猎聘 职责描述： 1、工艺平台及器件调研，反向工程分析，器件类型规划及Spec定义。 2、结合器件仿真和工艺集成，确定器件结构和工艺流程条件，绘制版图和TSK。 3、制定器件测试方法和分析测试数据，优化器件和工艺方案。 4、器件相关版图设计规则制定，平台电学设计规则的编制发布和升级。 5、Flash/OTP/MTP/SRAM等单元版图和TSK绘制，器件开发和良率提升。 6、协助工艺集成解决完成PDK0.1，PDK0.5等 任职要求： 1. 硕士及以上学历 2. 微电子、半导体、理论物理、材料、通信、计算机、数学等相关专业 3. 工作认真细致，良好的沟通能力和团队合作精神，具有较强的信息安全和环保意识
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