小派科技(上海)有限责任公司
DP封装工艺工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
14 August 2026
What they need
该职位来源于猎聘 岗位职责 1：分析DP磨划、切割、研磨制造工艺，持续改进以达成质量﹑产量及成本目标 2：确定新产品生产工艺，保证生产的良好工艺性能 3：建立标准操作程序及工艺规范，并对生产及维修人员进行程序及规范培训 4：改进工艺能力以达到新的标准 5：建立全面工艺控制，保证产品质量 6：与客户及供应商合作，解决技术问题 7：评价及批准产品设计图，工艺流程及材料单 8：进行直接材料的性能测试 9.：跟踪资格及工程构造 岗位要求： 1：本科及以上学历，机械、电子、材料等相关专业。 2、5年以上半导体封装工艺工作经验 3：英语听读说能力 4：系统及分析思维能力
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