捷普科技(上海)有限公司
HPM工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Beijing, China
Work mode:
Onsite
Published on:
19 August 2026
What they need
该职位来源于猎聘 岗位职责: 1. HPM/TPM/PdM体系搭建、培训、落地:
- 主导或深度参与设备HPM体系搭建、落地
- 建立设备报警分级与响应机制,推动HPM流程标准化、数字化
- 制定并持续优化HPM预防性维护计划,平衡设备可用性与维护成本 2. OEE提升与数据分析
- 建立OEE数据采集与优化流程
- 定期输出设备性能分析报告(含MTBF、MTTR、OEE趋势、Top故障排名),定位瓶颈设备与瓶颈工序
- 利用设备Log数据进行原因分析,推动技术改进项目,显著提升OEE 3. 跨部门推动与项目落地
- 牵头设备相关的专项改善(如减少换线时间、降低重复故障率),协同工艺、生产、质量部门推动措施落地 4. 备件与维修流程制定、优化
- 参与关键备件策略制定
- 对高频更换备件进行失效分析,提出改进或替代方案
任职要求: 1. 学历要求:本科及以上,机械、自动化、电子、微电子、工业工程等相关专业 2. 工作经验: 3年以上半导体行业设备维护或相关岗位经验
- 行业背景: 半导体封装测试或晶圆制造经验
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