恩立经济咨询(深圳)有限公司
IC半导体封装工程师
25 days ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
25 September 2026
What they need
该职位来源于猎聘 任职要求： ①统招本科及以上学历 微电子/通讯/物理相关专业；
②三年以上E&E电子或IC芯片/晶圆封装测试过程质量管理经验。 ③熟悉IGBT/SiC/MEMS/MOSFET等车规级芯片封测及失效分析。 ④对熟悉车规级芯片标准（如 JESD47、AEC-Q100），及VDA 6.3 对供应商进行审核。 ④对芯片失效及可靠性测试具备良好的测试分析经验。
⑤具备良好的供应商审核及数据分析能力。
⑥质量工具SPC/MSA/DOE/CPK有实际应用经验。 ⑦具备良好的沟通表达及逻辑思维能力。
⑧英文读写熟练 口语可简单交流俱佳。 ⑨工作base地点：苏州/无锡/长三角地区
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