成都泰美克晶体技术有限公司
研发工程师（键合）(J10001)
2 months ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
23 August 2026
What they need
该职位来源于猎聘 岗位职责： 1.进行键合工艺相关产品研发工作，制定相关实验设计、执行及数据分析。 2.提出项目相关设备技术要求，负责工艺相关设备选型。 3.执行上级主管分配分配工作任务。 4.贯彻公司目标，按计划实施完成研发项目，并定期总结、报告。 岗位要求： 1. 成就导向；责任心强；积极主动。 2.具有键合行业工艺5年以上经验，如具有设备开发经验更优。 3.优秀的逻辑分析能力。
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