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硬件项目经理(J10242)

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Onsite

硬件项目经理(J10242)

捷普科技(上海)有限公司

硬件项目经理(J10242)

Skills

PythonR

2 months ago

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Important information


Contract type:

Permanent

Location:

Beijing, China

Work mode:

Onsite

Published on:

16 August 2026

What they need


该职位来源于猎聘 职责描述: 1. HPM/TPM/PdM体系搭建、培训、落地:

  • 主导或深度参与设备HPM体系搭建、落地
  • 建立设备报警分级与响应机制,推动HPM流程标准化、数字化
  • 制定并持续优化HPM预防性维护计划,平衡设备可用性与维护成本 2. OEE提升与数据分析
  • 建立OEE数据采集与优化流程
  • 定期输出设备性能分析报告(含MTBF、MTTR、OEE趋势、Top故障排名),定位瓶颈设备与瓶颈工序
  • 利用设备Log数据进行原因分析,推动技术改进项目,显著提升OEE 3. 跨部门推动与项目落地
  • 牵头设备相关的专项改善(如减少换线时间、降低重复故障率),协同工艺、生产、质量部门推动措施落地 4. 备件与维修流程制定、优化
  • 参与关键备件策略制定
  • 对高频更换备件进行失效分析,提出改进或替代方案 任职要求: 1. 学历要求:本科及以上,机械、自动化、电子、微电子、工业工程等相关专业 2. 工作经验: 3年以上半导体行业设备维护或相关岗位经验
  • 行业背景: 半导体封装测试或晶圆制造经验 技能要求: 1. 熟练使用数据分析工具(如Excel、Minitab、JMP、Python/R任一)进行设备性能分析 2. 能编写清晰的故障分析报告/8D报告,持续改进
  • 掌握OEE计算方法,有实际驱动OEE提升的成功案例
  • 熟悉FMEA、OCAP、5Why、PDCA等质量管理工具 5. 具有较强的沟通协调能力

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