深圳市易卜光电有限公司
切割研磨工程师(J10285)
2 months ago
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Important information
Contract type:
Permanent
Work mode:
Onsite
Published on:
15 August 2026
What they need
该职位来源于猎聘 职责描述： 负责DPS切割前晶圆贴膜、激光开槽、晶圆切割制程相关工作，提升产品质量，优化制程流程，降低生产成本，达成品质目标和客户满意。 任职要求： 1.熟悉封装行业前道BG（背面研磨）、wafer saw（晶圆切割）区域的工艺经验。
- 熟悉Disco品牌的BG和Saw设备，并能独立编写设备程序。
- 熟悉12寸Low K产品切割工艺、Laser切割工艺、和背胶产品切割工艺。
- 具备产线维护与工艺改进经验，产线异常调查。
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