日月新半导体有限公司
Laser cut 设备工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
12 August 2026
What they need
该职位来源于猎聘 任职资格: 1.本科及以上学历; 2.具备半导体封装制程laser cut设备的维修保养经验,熟悉laser cut工作原理 3.熟悉大族laser cut机型工作经验者优先 工作职责: 1.负责设备的大down机,大保养 2.设备维修SOP及保养计划制定 3.配合完成异常的分析及原因调查
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