塑封工艺工程师 Molding PE

该职位来源于猎聘 职位描述：

• Assembly mold yields improvement . 提升良率
• Driving assembly CIP for top defects and reduce O/S failure rate 驱动封装CIP，降低O/S故障率
• Establish/Update Control Plan, FMEA, OCAP and SOP for process optimization.

建立/更新控制计划，FMEA, OCAP和SOP以优化工艺。

• Customer audit handling and supplier qualification. 处理客户审核和供应商资格认证
• Customer complaint disposition and 8D report preparation. 处理客户投诉，准备8D报告 职位要求：
• Bachelor and above degree . 本科及以上学历 2. 5years semiconductor mold process . 5年以上半导体塑封工艺
• Good oral and written English.Good organizing &analytical skills . 良好的英语听说读写能力、组织能力、分析能力
• Good communication and coordination spirit during work. 良好的沟通协调能力