日月新半导体有限公司
半导体Molding设备工程师MD（成都）
3 months ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
8 August 2026
What they need
该职位来源于猎聘 工作内容： 1、机况、品质异常分析改善和报告汇整 2、负责设备能力提升专案，成本管控 3、技术员培训计划制定，对技术员周期系统培训 4、负责协助公司设备管理体系的建立与实施 5、负责设备技术、维护状态的分析与评价 6、负责所辖区域设备的维护与保养，及时处理设备现场的技术问题 7、负责设备技术革新、改造及相关资料、情报的收集与积累 8、负责机台导入、安装、调试等 任职资格： 1、大专及以上学历 2、5年以上工作经验 3、有半导体Molding设备操作经验，能独立完成设备维修保养者优先
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