日月新半导体有限公司
PLP工程师(J10233)
3 months ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
8 August 2026
What they need
该职位来源于猎聘 职责描述： 1.根据未来发展趋势开发新产品结构于制作流程（Panel Level Packaging） 2.根据产品需求来寻找新设备/材料，评估设备/材料能力于涉及的设备的相关功能来符合厂内产品需求 3.依照新产品结构流程来定义厂内文件 4.技术项目管理：Technical program management 5.新产品导入管理：Pre-NPI acticities management 任职要求： 大专及以上学历，5年及以上半导体工作经验；熟练使用电脑，会写报告;
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