C
Compal
系統與智慧平台處 - SW軟體設計理級主管(內湖) - TWPR01430
Skills
AILinux
2 months ago
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Important information
Contract type:
Permanent
Location:
Taipei, Taiwan
Work mode:
Onsite
Published on:
20 August 2026
What they need
- 定義次世代筆電的軟韌體架構（包含 BIOS/UEFI、EC、OS 驅動程式、專屬軟體與 AI 應用平台）。
與電子（EE）和機構（ME）團隊協同進行軟硬體協調設計（Co-design），優化系統功耗、動態電源分配（Power Management）與散熱演算法。
- 與OS 廠（Microsoft/ x86 driver）及晶片大廠（Intel/AMD/Qualcomm 等）技術對接，搶先導入最新平台技術並參與早期測試（Alpha/Beta Program）。
- Embedded/Linux(有限度的功能先顧)
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