[內湖/大園/龜山] 技術專案經理/主管 Technical PM/TPM Manager – 資料中心散熱與液冷系統

工作地點： 依人選需求可選擇在內湖總部、大園廠或龜山廠辦公，依專案需求提供遠端辦公彈性，惟須主管同意並主動回報工作進度。

匯報對象： 部門主管 / 高級專案經理

職務簡介 (About the Role)

Cooler Master 酷碼科技為世界頂尖的一站式散熱解決方案供應商，目前正積極拓展高效能運算 (HPC)、AI基礎設施與企業級資料中心基礎設施領域。身為技術專案經理 (TPM)，您將領導跨領域工程與製造團隊，為我們的核心 Hyperscale 超大型資料中心客戶設計、開發並量產先進的熱管理解決方案，包含高密度氣冷/液冷模組及液冷分配單元 (Cooling Distribution Unit, CDU)。您將擔任客戶技術需求與內部 R&D、NPI 及生產製造營運團隊之間的核心橋樑，確保專案從概念設計到量產階段均符合嚴格的品質、時程、散熱效能與成本目標。

主要職責 (Key Responsibilities)

• 專案執行與 NPI 流程管理

1.主導資料中心散熱產品（氣冷、水冷板 Cold Plate、液冷迴路及 CDU 等）之 NPI (新產品導入) 全生命週期管理（RFQ -> Concept -> EVT -> DVT -> PVT -> 量產）。

2.制定詳細的專案時程、里程碑、資源分配、風險控管計畫與預算追蹤。

3.在 OEM/ODM 製造環境下，管理試產執行、良率提升、工程變更通知 (ECO) 及 BOM 階段生命週期。

• 客戶對接與帳戶管理

1.擔任對接客戶工程與採購團隊的主要技術窗口。

2.定期主持技術對接會議、聯合設計審查 (Design Review)、生產準備度審查及專案進度匯報。

3.管理客戶期望，在嚴格的交付時程下平衡工程可行性，並快速解決技術與進度上的瓶頸。

• 跨部門領導與協調

1.與散熱/機構工程、電子工程、韌體、品質保證 (QA)、全球供應鏈及工廠營運團隊密切合作。

2.主導原型機試產階段的根因失效分析 (8D / FA)，並協調推動對應改善措施。

3.驅動關鍵水冷與機構零組件（如泵浦、熱交換器、閥門、快拆接頭 （Quick Disconnects）、感測器等）之供應商準備度。

應徵條件 (Qualifications & Requirements)

基本條件： 學歷背景： 專科、學士或碩士以上學位。理科主修佳。

工作經驗： 5 年以上電子產品或電腦硬體 OEM / ODM 製造業之技術專案管理經驗。主管職需具備 10 年以上相關經驗。

領域知識： 具備扎實之電子製造業TPM經歷。具PC/Server 硬體架構、機構電子整合及 NPI 製造流程經驗者優先錄取。

語言能力： 具備流利之英語聽說讀寫能力，能自信地向國外客戶進行技術簡報與溝通。

軟實力： 具備優秀的邏輯分析能力、風險管理意識及跨部門衝突協調能力。

加分條件 (Preferred Qualifications)

1. 資料中心 / 散熱經驗： 具備企業級散熱產品經驗，如水冷系統（Direct-to-Chip / Cold Plate、浸沒式冷卻）或液冷分配單元 (CDU) 相關開發經驗者佳。

2. Hyperscaler 對接經驗： 具備與大型雲端服務供應商 (CSP) / Hyperscaler（如 Meta、AWS、Microsoft、Google、OpenAI 等）合作對接之經驗。

3. 專業認證： 持有 PMP (Project Management Professional) 證照或 Agile/Scrum 相關認證。

成功關鍵特質 (Key Competencies)

1. 客戶導向 (Customer Focus)： 能在高強度、高節奏的 Hyperscale 專案需求下保持專業與高抗壓性。

2. 技術理解力 (Technical Acumen)： 具備與散熱、機構及流體力學工程師深入討論技術 trade-off 的能力。

3. 當家作主與敏捷應變 (Ownership & Agility)： 具備高度主動性，能穿越不確定性並克服製造挑戰，確保專案按時交付。

歡迎身心障礙人士，需附身心障礙證明

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Location: Neihu, Guei-Shan, Da-Yuan; depends on candidate preference. Remote work flexibility, subject to project and supervisor approval.

Reports To: Department Head / Sr. PM Manager

About the Role

As the world's leading enterprise/industrial cooling solution provider, Cooler Master is expanding its footprint in next-generation high-performance computing (HPC) and enterprise data center infrastructure. As a Technical Program Manager (TPM) , you will lead cross-functional engineering and manufacturing teams to design, develop, and deploy advanced thermal management solutions—including high-density air/liquid cooling modules and Cooling Distribution Units (CDUs)—for our tier-1 hyperscale customer.

You will bridge customer technical requirements with internal R&D, NPI, and manufacturing operations, ensuring program execution meets rigorous quality, timeline, thermal efficiency, and cost targets from concept to mass production.

Key Responsibilities

1. Program Execution & NPI Management

• Lead end-to-end New Product Introduction (NPI) lifecycle (RFQ → Concept → EVT → DVT → PVT → Mass Production) for data center thermal products (air cooling, cold plates, liquid loops, and CDUs).
• Define program scope, detailed schedules, milestones, resource allocation, risk mitigation plans, and budget tracking.
• Oversee build execution, yield improvement, Engineering Change Orders (ECO), and BOM lifecycle management in an OEM/ODM manufacturing environment.

2. Customer Interface & Account Alignment

• Serve as the primary technical point of contact for customers' engineering and procurement teams.
• Lead regular technical syncs, joint design reviews, readiness reviews, and program status reporting.
• Manage customer expectations, balance engineering feasibility with aggressive timelines, and swiftly resolve technical/schedule bottlenecks.

3. Cross-Functional Leadership

• Partner closely with Thermal/Mechanical Engineering, Electrical Engineering, Firmware, Quality Assurance, Global Supply Chain, and Factory Operations.
• Facilitate root-cause failure analysis (8D/FA) during prototype build phases and coordinate rapid implementation of corrective actions.
• Drive vendor/supplier readiness for custom mechanical, fluidic, and electronic sub-assemblies (e.g., pumps, heat exchangers, valves, quick disconnects, sensors).

Qualifications & Requirements

Basic Qualifications:

• Education: Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Industrial Engineering, Systems Engineering, or a related technical discipline.
• Experience: 5+ years of hands-on Technical Program Management / Project Management experience in electronics or computer hardware OEM/ODM manufacturing . 10+ years of relevant experience for the managerial position.
• Domain Knowledge: Solid understanding of PC/Server hardware architecture, electromechanical assembly, and NPI manufacturing processes.
• Communication: Excellent verbal and written English/Chinese communication skills; confident presenting technical updates to external customer leadership.
• Problem Solving: Strong analytical, risk management, and cross-functional conflict-resolution capabilities.

Preferred Qualifications (Nice-to-Haves)

• Data Center / Thermal Expertise: Direct experience with enterprise thermal management products, such as liquid cooling systems (Direct-to-Chip / Cold Plates, Immersion Cooling) or Cooling Distribution Units (CDUs).
• Hyperscaler Experience: Prior experience interfacing with major Cloud Service Providers (CSPs) / hyperscalers (e.g., Meta, AWS, Microsoft, Google, OpenAI).
• Certifications: PMP (Project Management Professional) or Agile/Scrum certification.

Key Competencies for Success

• Customer Focus: Ability to represent Cooler Master professionally under fast-paced, high-stakes hyperscale program demands.
• Technical Acumen: Capability to engage deeply with thermal, mechanical, and fluid dynamics engineers on technical trade-offs.
• Ownership & Agility: Strong drive to navigate ambiguity, overcome manufacturing hurdles, and deliver projects on schedule.