Compal
智慧型裝置事業群 - Thermal 主任工程師/理級主管(內湖) - TWPR12399
2 months ago
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Important information
Contract type:
Permanent
Location:
Taipei, Taiwan
Work mode:
Onsite
Published on:
21 August 2026
What they need
負責伺服器產品之熱設計與散熱解決方案開發，涵蓋氣冷與水冷架構評估、模擬分析（CFD）、實機驗證（Thermal Characterization）、除錯改善與量產導入。與 EE/ME、SI/PI、Firmware、Validation、Manufacturing、Supplier 協作，確保產品在各種環境與工作負載下達成溫度規格、噪音/功耗目標、可靠度與量產一致性。
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