Ibrahima Dieng

As a consultant, my primary responsibility was to engage in the analysis of the issues encountered by the company in relation to certain products they develop and commercialize for major players in the aviation industry. I actively participated in the authorship of sophisticated C/C++ scripts that automated and streamlined the debugging process, while also contributing to the advancement of embedded C/C++ codes.

The applications offered by the millimeter wave range are diverse and promising, ranging from high-speed communication to long-range radar, imaging, and detection systems. However, utilizing this frequency band, which enables higher data rates, requires innovation in the tools for testing and validating RF components dedicated to this band. Therefore, this internship is part of an effort to improve the correlation between the measurements taken in the characterization chamber and the electromagnetic simulations of RF passives. The objective of this internship is to evaluate calibration methods, particularly the on-wafer TRL, for the extraction of RF passives up to a frequency of 220 GHz. Throughout the internship, a comparison between measurements and electromagnetic simulations was conducted to validate the results obtained. To conduct this work, the BICMOS55 technology was used. This technology is developed by STMicroelectronics to provide a silicon technology platform for RF system development. The technology has the particularity of offering both bipolar and CMOS transistors on the same chip. The bipolar transistor enables higher gain and speed, which are essential for high-frequency analog components, while the CMOS allows for low-power logic circuits.

I was in the R&D team and contributed to the development of an electronic sorting sensor capable of sorting plastic waste for recycling. The goal was to program a synchronous modulation and acquisition chain on the ATmega32U4. I participated in the design of the electronic system and in the development of the different modules from the design phase to the module test phase.